About HSP Technologies
Hyper-Sub Platform Technologies, Inc. (HSP Technologies) is a Florida corporation that has designed, built and tested the Hyper-Sub. The world’s first vessel that can serve as both a high-speed surface craft and a deep-sea dive submarine.
With the successful and proven technology of the Hyper Sub firmly established, HSP is now moving forward with the Series II where capabilities and functionality will be refined and enhanced.
Even though HSP Technologies has been approached numerous times to by other corporations wanting to acquire the technology, founder Reynolds Marion decided not to accept those offers and instead chose to continue following this life-long passion in order to see it to fruition. That time has come.
HSP Tech will take all the advancements and capabilities of the Series I and improve upon the designs and functionalities that will make the Series II a revolutionary, indispensable maritime technology that reduces the costs and increases the safety and convenience of submersible operations worldwide.
U.S. Patent No. 7,246,566 B2
U.S. Patent No. 7,856,938 B2
Republic of South Africa Patent No. 2010/00873
New Zealand Patent No. 583094
Singapore Patent No.158285
Australia Patent No. 2007356454
Israel Patent No. 203168
Hong Kong No. 11101830.9
Canada Patent Serial No.2,730,100 (Pending)
China Patent Application No. 200780100518.0 (Pending)
European Union (EPO) Patent Application No. 07799369.9 (Pending)
United Arab Emirates Patent Application No. 9/2010 (Pending)
Brazil Patent Application No. PI0721894-0 (Pending)
South Korea Patent Application No. 10-2010-7002341 (Pending)
Malaysia Patent Application No. PI2010000040 (Pending)
India Patent Application No. 00697/CHENP/2010 (Pending)